Feb 22, 2026
Two-phase microchannel heat exchangers for cooling integrated circuit (IC) dies and cooling systems employing the same are disclosed. The heat exchangers include thermal masses having a...
Nov 05, 2025
Accordingly, research on integrating multifunctional thermal management composite materials for designing micro-channels has become a hot development trend. Notably, the design
Apr 07, 2026
A configurable, double sided, manifold micro-channel cold plate includes a one or more manifold micro-channel cold plate cells. Each cold plate cell includes a manifold body, a manifold
Feb 16, 2026
Micro pulsating heat pipes — passive, wickless, self-oscillating — are moving from laboratory curiosity to near-commercial deployment. This report maps the patent and literature
Nov 27, 2025
Microfluidic devices with partially enclosed microfluidic channels and methods for forming perfusable vascular networks Abstract A device includes a substrate having a top surface and a bottom surface
Oct 19, 2025
In this study, pressure drop and heat transfer characteristics of multiple-mini-channel thermal modules were investigated quantitatively. The flow cha
Mar 19, 2026
a respective inlet and outlet to permit flow, in particular two-phase flow, of a working fluid. The plural microchannels are arranged such that adjacent microchannels accommodate flow of working fluid in
Jun 06, 2026
Accordingly, the single configurable, double sided MMC cold plate provides a compact, lightweight design to provide enhanced thermal management to six or more electronic devices and/or
Dec 28, 2025
The high-power integrated chips face severe thermal management problems, and the embedded micro channel cooling method is an effective heat dissipation technique for high density
Jun 03, 2026
Through the micro-channel cold plate device, the cold plate for liquid cooling radiating is uniform in temperature distribution, has lower thermal resistance and better radiating performance, and
Oct 24, 2025
In another embodiment, an electronics module includes a heat receiving Surface, a semiconductor device thermally coupled to the heat receiving Surface, an inlet manifold coupled to the heat
Aug 11, 2025
The subject disclosure relates to 3D microelectronic chip packages with embedded coolant channels. The disclosed 3D microelectronic chip packages provide a complete and practical mechanism for
Feb 20, 2026
Fig. 1 is a schematic diagram of the structure of the micro-module data center with totally closed cold and hot channels. As shown in the figure: 1. the system comprises a cabinet, 2, a skylight assembly,
Jun 24, 2026
A microfluidic device having a channel within a first material to thermally couple with an IC die. The channel defines an initial fluid path between a fluid inlet port and a fluid outlet port.
Jul 02, 2026
Micro heat exchanger innovation spans data center cooling, aerospace thermal management, and HVAC miniaturisation — with AI-integrated control, additive manufacturing, and
Nov 07, 2025
A high-performance heatsink comprises microfluidic channels in a high thermal conductivity silicon carbide (SiC) body for providing enhanced active cooling of an IC device.
Feb 28, 2026
This paper investigated the thermo-mechanical performance of microchannel-based technology to actively cool high power electronic modules,
May 10, 2026
A microfluidic device having a channel within a first material to thermally couple with an IC die. The channel defines an initial fluid path between a fluid inlet port and a fluid outlet...
Jul 22, 2025
Furthermore, channel features for both sides of the cold plate as an add-on module may be formed concurrently and in batches using double-sided anisotropic wet etching. The embodiments
Dec 29, 2025
The present disclosure relates to microfluidic channels for cooling hybrid bonding interfaces. A semiconductor device having a hybrid bonding interface with a microfluidic channel is provided.
Dec 18, 2025
Abstract The power electronic module plays a key role in the power system by providing the needed physical support, electrical contact and insulation, and thermal pathway for power devices.
Feb 13, 2026
A micro-channel heat exchanger suited for use in large-area cold plates includes a heat transfer member having winding micro-channels, a manifold, and a cover plate. The micro-channels'' winding design is
Jul 19, 2025
The heat generation of electronic devices is increasing dramatically, which causes a serious bottleneck in the thermal management of electronics,
May 12, 2026
To address the escalating thermal management demands, embedded manifold microchannel cooling (EMMC) has been regarded as a promising technology for thermal management due to its
Nov 18, 2025
Abstract: The phased array radar T/R (transmit/receive) module is faced with increasing power and heat accumulation under extreme operating conditions. To ensure the reliability of the T/R module with 3D
Dec 01, 2025
It is the adhesive layer that makes the thermoelectric micro-cooler elastic, owing to which thermo-mechanical stresses in the module arisen under repeated thermocycling can be compensated.
May 19, 2026
The invention relates to a method of making a brazed micro-channel cold plate assembly for cooling a heat producing electronic component. The primary components of a cold plate assembly are a base
Apr 26, 2026
The rapid development of high-power-density semiconductor devices has rendered conventional thermal management techniques inadequate for
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